A microelectromechanical systems (MEMS) temperature sensor based on a cascade three-stage "bent-beam" structure is described in this paper. A suspended structure mechanically deforms in response to the change in ambient temperature, and then, a displacement is obtained; the structure is composed of three cascaded systems in order to enhance sensor sensitivity. The final conversion is made to an electrical signal that is obtained by using an interdigitated capacitor having one electrode fixed to the substrate and one electrode embedded into the moving tip of the MEMS sensor. The device has been conceived to operate passively in harsh environments where high temperatures could harm active electronic devices. The readout of the unknown temperature is therefore remotely performed by coupling the variable MEMS capacitor to a fixed inductor to compose a resonant LC circuit, which ismagnetically coupled to a reader circuit placed outside the environment where the measurement takes place. The temperature to be measured is therefore first converted into a displacement that, in turn, induces a change in a capacitor value; a variation in the resonant frequency of an LC circuit is finally observed through the remote readout circuit. This paper focuses on the analytical and numerical modeling of both the temperature-todisplacement and displacement-to-capacitance conversions, on the design and fabrication of an experimental prototype, on the experimental validation where results are extensively presented and commented, and, finally, on the design of the integrated resonant device for contactless measurements.