Conference Papers Year : 2015

A Methodology for the Analysis of Memory Response to Radiation through Bitmap Superposition and Slicing

Alexandre Louis Bosser
Test and dEpendability of microelectronic integrated SysTems
Viyas Gupta
  • Function : Author
  • PersonId : 1231992
Test and dEpendability of microelectronic integrated SysTems
Georgios Tsiligiannis
Conception et Test de Systèmes MICroélectroniques
Rudy Ferraro
Test and dEpendability of microelectronic integrated SysTems
Christopher Frost
  • Function : Author
  • PersonId : 938538
​​​​​​​​​​​​​​​​​​​​​​​​​​​​​​​​​​​​​​​​​​​​​​​​​​​​​​​​​​​​​​​​​​​​​​​​​​​​​​​​​​​​​​​​​​​​​​​​​​​​​​​​​​​​​​​​ISIS Neutron and Muon Source
Ali Mohammadzadeh
  • Function : Author
Arto Javanainen
  • Function : Author
Helmut Puchner
Mario Rossi
  • Function : Author
Frédéric Saigné
Institut d’Electronique et des Systèmes
Ari Virtanen
  • Function : Author
Frédéric Wrobel
Radiations et composants
Institut d’Electronique et des Systèmes
CV
Luigi Dilillo
Conception et Test de Systèmes MICroélectroniques
CV

Abstract

A methodology is proposed to perform statistical analysis of radiation test data of memories searching for trends in the error distribution. The treated case study is a 65nm SRAM irradiated with neutrons, protons and heavy-ions.

Keywords

Memories SER MCU Bitmap SEU

Domains

Electronics

Luigi Dilillo  : Connect in order to contact the contributor

https://hal-lirmm.ccsd.cnrs.fr/lirmm-01238397

Submitted on : Friday, December 4, 2015-6:08:06 PM

Last modification on : Wednesday, April 10, 2024-9:32:39 AM

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Dates and versions

lirmm-01238397 , version 1 (04-12-2015)

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Cite

Alexandre Louis Bosser, Viyas Gupta, Georgios Tsiligiannis, Rudy Ferraro, Christopher Frost, et al.. A Methodology for the Analysis of Memory Response to Radiation through Bitmap Superposition and Slicing. RADECS: Radiation and Its Effects on Components and Systems, Sep 2015, Moscou, Russia. ⟨10.1109/RADECS.2015.7365578⟩. ⟨lirmm-01238397⟩

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CNRS IES SYSMIC LIRMM TEST LIRMM_MIC MIC MIPS UNIV-MONTPELLIER
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