TSV aware timing analysis and diagnosis in paths with multiple TSVs - LIRMM - Laboratoire d’Informatique, de Robotique et de Microélectronique de Montpellier Access content directly
Conference Papers Year : 2014

TSV aware timing analysis and diagnosis in paths with multiple TSVs

Abstract

3D-IC test becomes a challenge with the increasing number of TSVs and demands for effective 3D aware test techniques. In this work, we propose a timing aware model to capture delay variations on a path due to resistive open TSVs. The key idea is to analytically model delay and apply our correlation-based resistive open TSV detection method to attain path delay fault coverage. We propose two methods to investigate timing variation introduced by resistive open TSVs in a critical path delay with multiple TSVs. Method I computes the correlation of multiple TSVs in a path to overall path delay to determine if TSVs are the source of the introduced delay. Method II pinpoints which TSV is faulty by computing the delay fault coverage of each TSV in a path with multiple TSVs. Our results indicate the accuracy of our proposed method and promotes early identification of resistive open defects TSVs.
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Dates and versions

lirmm-01248594 , version 1 (17-07-2019)

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Carolina Momo Metzler, Aida Todri-Sanial, Alberto Bosio, Luigi Dilillo, Patrick Girard, et al.. TSV aware timing analysis and diagnosis in paths with multiple TSVs. VTS: VLSI Test Symposium, Apr 2014, Napa, CA, United States. ⟨10.1109/VTS.2014.6818772⟩. ⟨lirmm-01248594⟩
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