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Scan-chain intra-cell defects grading

Abstract : With the continuous scaling down of the transistor size, the so-called intra-cell defects are more and more frequent. Several works analyze the impact of intra-cell defects w.r.t. the test quality. However, to the best of our knowledge, none of them target intra-cell defects affecting scan flip-flops. This paper presents an evaluation of the effectiveness of the ATPG test patterns in terms of intra-cell defect coverage affecting scan flip-flops. The experimental results show that a meaningful test solution has to be developed to improve the overall defect coverage for the scan chain testing.
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Submitted on : Tuesday, May 17, 2016 - 3:09:32 PM
Last modification on : Friday, November 27, 2020 - 6:04:03 PM




Aymen Touati, Alberto Bosio, Luigi Dilillo, Patrick Girard, Arnaud Virazel, et al.. Scan-chain intra-cell defects grading. DTIS: Design and Technology of Integrated Systems in Nanoscale Era, Apr 2015, Naples, Italy. ⟨10.1109/DTIS.2015.7127349⟩. ⟨lirmm-01272696⟩



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