Mechanical Solution for Out-of-Plane Sensitivity Enhancement of CMOS MEMS Convective Accelerometers - LIRMM - Laboratoire d’Informatique, de Robotique et de Microélectronique de Montpellier Accéder directement au contenu
Communication Dans Un Congrès Année : 2018

Mechanical Solution for Out-of-Plane Sensitivity Enhancement of CMOS MEMS Convective Accelerometers

Résumé

In this paper, a 3D finite element model for CMOS MEMS convective accelerometers is developed. The model validation is then performed using reported experimental values of sensor sensitivity. Among these values, the out-of-plane ones are the lowest. For improvement, a mechanical solution is proposed by assuring a vertical displacement of the heater plate when submitted to z-axis accelerations. This solution is presented and then analyzed using the developed model. Optimal location for the z-axis detectors is also explored. The study shows that a substantial increase of 300% in out-of-plane sensitivity can be attained if the proposed mechanical solution is applied.
Fichier non déposé

Dates et versions

lirmm-02354212 , version 1 (12-11-2019)

Identifiants

Citer

Sonia Abdellatif, Brahim Mezghani, Fares Tounisi, Frédérick Mailly, Pascal Nouet. Mechanical Solution for Out-of-Plane Sensitivity Enhancement of CMOS MEMS Convective Accelerometers. ICECS 2018 - 25th International Conference on Electronics, Circuits and Systems, Dec 2018, Bordeaux, France. pp.301-304, ⟨10.1109/ICECS.2018.8617928⟩. ⟨lirmm-02354212⟩
61 Consultations
0 Téléchargements

Altmetric

Partager

Gmail Facebook X LinkedIn More