Skip to Main content Skip to Navigation
Conference papers

Mechanical Solution for Out-of-Plane Sensitivity Enhancement of CMOS MEMS Convective Accelerometers

Abstract : In this paper, a 3D finite element model for CMOS MEMS convective accelerometers is developed. The model validation is then performed using reported experimental values of sensor sensitivity. Among these values, the out-of-plane ones are the lowest. For improvement, a mechanical solution is proposed by assuring a vertical displacement of the heater plate when submitted to z-axis accelerations. This solution is presented and then analyzed using the developed model. Optimal location for the z-axis detectors is also explored. The study shows that a substantial increase of 300% in out-of-plane sensitivity can be attained if the proposed mechanical solution is applied.
Complete list of metadatas

https://hal-lirmm.ccsd.cnrs.fr/lirmm-02354212
Contributor : Pascal Nouet <>
Submitted on : Tuesday, November 12, 2019 - 12:35:10 PM
Last modification on : Wednesday, November 13, 2019 - 1:34:23 AM

Identifiers

Citation

Sonia Abdellatif, Brahim Mezghani, Fares Tounisi, Frédérick Mailly, Pascal Nouet. Mechanical Solution for Out-of-Plane Sensitivity Enhancement of CMOS MEMS Convective Accelerometers. ICECS: International Conference on Electronics, Circuits and Systems, Dec 2018, Bordeaux, France. pp.301-304, ⟨10.1109/ICECS.2018.8617928⟩. ⟨lirmm-02354212⟩

Share

Metrics

Record views

56