Mechanical Solution for Out-of-Plane Sensitivity Enhancement of CMOS MEMS Convective Accelerometers - LIRMM - Laboratoire d’Informatique, de Robotique et de Microélectronique de Montpellier Access content directly
Conference Papers Year : 2018

Mechanical Solution for Out-of-Plane Sensitivity Enhancement of CMOS MEMS Convective Accelerometers

Abstract

In this paper, a 3D finite element model for CMOS MEMS convective accelerometers is developed. The model validation is then performed using reported experimental values of sensor sensitivity. Among these values, the out-of-plane ones are the lowest. For improvement, a mechanical solution is proposed by assuring a vertical displacement of the heater plate when submitted to z-axis accelerations. This solution is presented and then analyzed using the developed model. Optimal location for the z-axis detectors is also explored. The study shows that a substantial increase of 300% in out-of-plane sensitivity can be attained if the proposed mechanical solution is applied.
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lirmm-02354212 , version 1 (12-11-2019)

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Sonia Abdellatif, Brahim Mezghani, Fares Tounisi, Frédérick Mailly, Pascal Nouet. Mechanical Solution for Out-of-Plane Sensitivity Enhancement of CMOS MEMS Convective Accelerometers. ICECS 2018 - 25th International Conference on Electronics, Circuits and Systems, Dec 2018, Bordeaux, France. pp.301-304, ⟨10.1109/ICECS.2018.8617928⟩. ⟨lirmm-02354212⟩
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